เครื่องยกซิพ รุ่น WDS-4860
เครื่องยกซิพ WDS-4860
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Universal bga reballing machine WDS-4860 motherboard bga chip rework station
Widely used to reworking BGA in motherboard (laptop, PS3,PS4,XBOX360, Mobile phone, Network set top box etc)
Detail Parameter:
Total Power |
4800W |
Upper Heating Power |
800W |
Lower Heating Power |
Second zone:1200W, Third zone:( IR )2700W |
Power Supply |
AC 220V±10V 50/60HZ |
Overall Dimension |
760*760*680mm |
Locating Mode |
V-shape card slot, PCB holder can be adjustable by X and Y axes with universal jigs. |
Temperature Controlling |
K-type thermocouple closed loop control, independent temperature control, precision up to ±3 degree |
PCB Size |
Max 410*370mm, Min 20*20mm |
Thermocouple ports |
1 unit |
Weight of machine |
40KG |
Main feature:
1.Perfect support Soldering, Desoldering, Removing and Mounting the BGA Chip
2.Touch screen and PLC controlling to ensure it work stably and reliably.
3.Components mounting accuracy within 0.01mm , Repair success rate 99%
4.Rework BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc
5.Precise Temperature Control, accuracy within 3℃
6.Superior Safety Functions, with Emergency protection
7.Humanized design user-friendly operation system
8. Hot air nozzle can be rotated in 360 degree
9.Samsung, Sony,ASUS,Lenovo also use this model for their repair service