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WDS-4860

Universal bga reballing machine WDS-4860 motherboard bga chip rework station

 

Widely used to reworking BGA in motherboard (laptop, PS3,PS4,XBOX360, Mobile phone, Network set top box etc)

 

 

Detail Parameter:

 

Total Power

4800W

Upper Heating Power

800W

Lower Heating Power

Second zone:1200W, Third zone:( IR )2700W

Power Supply

AC 220V±10V  50/60HZ

Overall Dimension

760*760*680mm

Locating Mode

V-shape card slot, PCB holder can be adjustable

by X and Y axes with universal jigs.

Temperature Controlling

K-type thermocouple closed loop control, independent temperature control, precision up to ±3 degree

PCB Size

Max 410*370mm,  Min 20*20mm

Thermocouple ports

 1 unit 

Weight of machine

40KG

 

Main feature:

 

1.Perfect support Soldering, Desoldering, Removing and Mounting the BGA Chip

 2.Touch screen and PLC controlling to ensure it work stably and reliably.

 3.Components mounting accuracy within 0.01mm , Repair success rate 99%

 4.Rework BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc

 5.Precise Temperature Control, accuracy within 3℃

 6.Superior Safety Functions, with Emergency protection 

 7.Humanized design user-friendly operation system 

 8. Hot air nozzle can be rotated in 360 degree

 9.Samsung, Sony,ASUS,Lenovo also use this model for their repair service

 

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